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2 x 22 W stereo BTL differential amplifier
TDA1556Q
with speaker protection and dynamic
mute/stand-by
VP
DDD
handbook, full pagewidth
2200
100
µF
nF
414 5 13
1/2 Rs 220 nF
1
6
Z
i1
audio
Rload
source
Z
i2
8
1/2 Rs 220 µF 2
n.c.
9
Vref 15
4.7
n.c.
3
µF
TDA1556Q
1/2 R 220 nF
s
16
10
Z
i3
audio
Rload
source
Z
i4
12
1/2 Rs 220 µF
17
7 11
MLA380-2
Fig.4 Stereo BTL test diagram.
July 1994 8
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
TDA1556Q
with speaker protection and dynamic
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L3
L
Q
c
117
e1 e2 v M
w M m
Z
bp
e
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A2 bp c D(1) d Dh E(1) e e e Eh j L L3 m Q v w x Z(1)
1 2
17.0 4.6 0.75 0.48 24.0 20.0 12.2 3.4 12.4 2.4 2.1 2.00
mm 10 2.54 1.27 5.08 6 0.8 0.4 0.03
4.3
15.5 4.2 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT243-1
95-03-11
July 1994 9
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
TDA1556Q
with speaker protection and dynamic
The device may be mounted up to the seating plane, but
SOLDERING
the temperature of the plastic body must not exceed the
Introduction
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
There is no soldering method that is ideal for all IC
may be necessary immediately after soldering to keep the
packages. Wave soldering is often preferred when
temperature within the permissible limit.
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
Repairing soldered joints
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
Apply a low voltage soldering iron (less than 24 V) to the
situations reflow soldering is often used.
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
This text gives a very brief insight to a complex technology.
soldering iron bit is less than 300 °C it may remain in
A more in-depth account of soldering ICs can be found in
contact for up to 10 seconds. If the bit temperature is
our  IC Package Databook (order code 9398 652 90011).
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
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